NTD95N02RT4G【PDF 1/6 页】MOSFET N-CH 24V 12A DPAK

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NTD95N02R

Power MOSFET

95 Amps, 24 Volts

N?Channel DPAK

Features

? High Power and Current Handling Capability

? Fast Switching Performance

? Low R DS(on) to Minimize Conduction Loss

? Low Gate Charge to Minimize Switching Losses

? Pb?Free Packages are Available

http://onsemi.com

V (BR)DSS R DS(ON) TYP I D MAX*

4.5 m W @ 10 V

24 V 95 A

5.9 m W @ 4.5 V

*I D MAX in the product summary table is continuous

and steady at 25 ° C.

Applications

? CPU Motherboard Vcore Applications

? High Frequency DC?DC Converters

? Motor Drives

? Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise specified)

Parameter

Drain?to?Source Voltage

Gate?to?Source Voltage

Symbol

V DSS

V GS

Value

± 20

Unit

MARKING DIAGRAMS

& PIN ASSIGNMENTS

Thermal Resistance, Junction?to?Case

Total Power Dissipation @ T A = 25 ° C

Drain Current –

? Continuous @ T A = 25 ° C, Limited by Package

? Continuous @ T A = 25 ° C, Limited by Wires

Thermal Resistance, Junction?to? Ambient

(Note 1)

? Total Power Dissipation @ T A = 25 ° C

? Drain Current ? Continuous @ T A = 25 ° C

R q JC

P D

I D

R q JA

P D

I D

1.45

2.4

15.8

° C/W

1 2

DPAK

CASE 369AA

(Surface Mount)

STYLE 2

Gate

Drain

Source

Thermal Resistance, Junction?to?Ambient

(Note 2)

? Total Power Dissipation @ T A = 25 ° C

? Drain Current ? Continuous @ T A = 25 ° C

Operating Junction and Storage Temperature

Continuous Source Current (Body Diode)

R q JA

P D

I D

T J ,

T STG

I S

100

1.25

?55 to

150

° C/W

° C

DPAK

CASE 369D

(Straight Lead)

Drain

Single Pulse Drain?to?Source Avalanche

Energy – (V DD = 25 V, V G = 10, I PK = 13 A,

L = 1 mH, R G = 25 W )

E AS

STYLE 2

Lead Temperature for Soldering Purposes

(1/8 in from case for 10 seconds)

T L

260

° C

1 2 3

Gate Drain Source

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq

[1 oz] including traces).

T95N02R

= Year

= Work Week

= Device Code

= Pb?Free Package

2. Surface mounted on FR4 board using the minimum recommended pad size

(Cu area = 0.412 in sq).

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

? Semiconductor Components Industries, LLC, 2006

July, 2006 ? Rev. 3

Publication Order Number:

NTD95N02R/D

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